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Failure Analysis Engineer (Nanoprobe 226820

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$4200 to $5200 (Monthly)

Posted a year ago

Job Overview


The responsibility of this position is to perform analysis of Qualcomm products to determine root cause of a failure. This effort will consist of using a variety of appropriate mechanical, chemical, and electrical analysis techniques to support failures of customer returned, yield related and reliability related.




Job Requirements:


· Degree/major in Microelectronics, IC Design, Physics or equivalent.


· Proficiency in various physical and electrical analysis techniques such as mechanical polishing, Chemical delayering, SEM inspection, curve trace, thermal emission, photon emission, OBIRCH/TIVA.


· Preferred qualifications if with experience in nano-probing for advanced tech node device.


· Strong knowledge of semiconductor physics, semiconductor devices, circuitry analysis and wafer fabrication process.


· Advantage if have years of FA experience in semiconductor industry, but fresh graduates are welcome to apply.


· Must be a good communicator, have good organization and project management skills, be able to work in a laboratory environment, and be effective getting results by working with multi-functional teams.


· Fast for learning and able to perform independent work.


· Flexible working time and able to work on weekend shift or mid-night shift.

If you have questions about this job, please click on apply. The employer will contact you then.

More about QUALCOMM GLOBAL TRADING PTE. LTD.

QUALCOMM GLOBAL TRADING PTE. LTD.
QUALCOMM GLOBAL TRADING PTE. LTD.
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Qualcomm Technologies, Inc. (QTI) is the world leader in supplying 3G/4G integrated circuit solutions for cellular wireless standards and is the number one fabless semiconductor company in the world. In order to drive our next phase of growth in cellular, wireless peripherals and 4G, we are expanding our Product Development and Test Engineering group at our Test Center of Excellence (TCE) in Singapore.  The Product Development and Test Engineering group develops test solutions for design verification of highly integrated RF receivers / transmitters / transceivers, power management, analog and mixed signal ASICs designed by Qualcomm. We work with Design, Foundry, Program Management, Yield, Reliability, Marketing, Sales and Manufacturing teams to create, commercialize and support Qualcomm’s products.